Thermal analysis and experimental validation of laminar heat transfer and pressure drop in serpentine channel heat sinks for electronic cooling

Xiaohong Hao, Bei Peng, Gongnan Xie, Yi Chen

Research output: Contribution to journalArticle

Abstract

In this paper, a thermal resistance network analytical model is proposed to investigate the thermal resistance and pressure drop in serpentine channel heat sinks with 180¿deg bends. The total thermal resistance is obtained using a thermal resistance network model based on the equivalent thermal circuit method. Pressure drop is derived considering straight channel and bend loss because the bends interrupt the hydrodynamic boundary periodically. Considering the effects of laminar flow development and redevelopment, the bend loss coefficient is obtained as a function of the Reynolds number, aspect ratios, widths of fins, and turn clearances, through a three-regime correlation.
Original languageEnglish
Article number031009
Number of pages9
JournalJournal of Electronic Packaging
Volume136
Issue number3
DOIs
Publication statusPublished - 2014

Keywords

  • heat transfer
  • analytical model
  • laminar flow
  • computer modelling

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