Abstract
In this paper, a thermal resistance network analytical model is proposed to investigate the thermal resistance and pressure drop in serpentine channel heat sinks with 180¿deg bends. The total thermal resistance is obtained using a thermal resistance network model based on the equivalent thermal circuit method. Pressure drop is derived considering straight channel and bend loss because the bends interrupt the hydrodynamic boundary periodically. Considering the effects of laminar flow development and redevelopment, the bend loss coefficient is obtained as a function of the Reynolds number, aspect ratios, widths of fins, and turn clearances, through a three-regime correlation.
| Original language | English |
|---|---|
| Article number | 031009 |
| Number of pages | 9 |
| Journal | Journal of Electronic Packaging |
| Volume | 136 |
| Issue number | 3 |
| DOIs | |
| Publication status | Published - 2014 |
Keywords
- heat transfer
- analytical model
- laminar flow
- computer modelling
Fingerprint Dive into the research topics of 'Thermal analysis and experimental validation of laminar heat transfer and pressure drop in serpentine channel heat sinks for electronic cooling'. Together they form a unique fingerprint.
Cite this
Hao, X., Peng, B., Xie, G., & Chen, Y. (2014). Thermal analysis and experimental validation of laminar heat transfer and pressure drop in serpentine channel heat sinks for electronic cooling. Journal of Electronic Packaging, 136(3), [031009]. https://doi.org/10.1115/1.4027508