The Multidimensional Integrated Intelligent Imaging project (MI-3)

Dejan Karadaglic, Nigel Allinson, Thalis Anaxagoras, Jennifer Aveyard, Costas Arvanitis, Richard Bates, Andrew Blue, Sarah Bohndiek, Jorge Cabello, L. Chen, S. Chen, Andrew Clark, Catherine Claytion, E. Cook, Andrew Cossins, James Crooks, Mohammad El-Gomati, Phil Evans, Wasi Faruqi, M. FrenchJ. Gow, Timothy Greenshaw, T. Greig, N. Guerrini, E. Harris, R. Henderson, Andrew Holland, G. Jeyasundra, A. Konstantinidis, H. Liang, K. Maini, G. McMullen, Alessandro Olivo, Val O'Shea, John Osmond, R. Ott, Mark Prydderch, Lin Qiang, Graine Riley, G. Royle, G. Segneri, R. Speller, J. Symonds-Tayler, S. Triger, Renato Turchetta, C. Venanzi, Kevin Wells, X. Zha, H. Zin

    Research output: Contribution to journalArticlepeer-review

    14 Citations (Scopus)


    MI-3 is a consortium of 11 universities and research laboratories whose mission is to develop complementary metal-oxide semiconductor (CMOS) active pixel sensors (APS) and to apply these sensors to a range of imaging challenges. A range of sensors has been developed: On-Pixel Intelligent CMOS (OPIC)—designed for in-pixel intelligence; FPN—designed to develop novel techniques for reducing fixed pattern noise; HDR—designed to develop novel techniques for increasing dynamic range; Vanilla/PEAPS—with digital and analogue modes and regions of interest, which has also been back-thinned; Large Area Sensor (LAS)—a novel, stitched LAS; and eLeNA—which develops a range of low noise pixels.
    Original languageEnglish
    Pages (from-to)196-198
    Number of pages3
    JournalNuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
    Issue number1-2
    Early online date5 Feb 2009
    Publication statusPublished - Jun 2009


    • active pixel sensors
    • metal-oxide semiconductor

    ASJC Scopus subject areas

    • Nuclear and High Energy Physics
    • Instrumentation
    • Atomic and Molecular Physics, and Optics
    • Radiation
    • Surfaces and Interfaces
    • Electrical and Electronic Engineering


    Dive into the research topics of 'The Multidimensional Integrated Intelligent Imaging project (MI-3)'. Together they form a unique fingerprint.

    Cite this