Nanometre scale reactive ion etching of GaN epilayers

D. Coquillat*, S. K. Murad, A. Ribayrol, C. J.M. Smith, R. M. De La Rue, C. D.W. Wilkinson, O. Briot, R. L. Aulombard

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

11 Citations (Scopus)

Abstract

We have demonstrated a process for the fabrication of sub-micron structures using high resolution etching to transfer patterns by masking with a bilayer of Titanium and SiNx. Reactive ion etching (RIE) was performed on GaN epilayers grown on (0001) sapphire by metal organic vapour phase epitaxy (MOVPE). Various chemistries were used to etch GaN including: HBr, SiCl4/HBr, CH4/H2, NH3/CH4/H2 and CH4/H2/O2. Patterns including pillars, holes and gratings with feature sizes ranging from 200 nm to 1 μm were produced. In a CH4/H2 plasma, quasi-vertical etching was achieved with sidewall angles greater than 81°.

Original languageEnglish
Pages (from-to)1403-1406
Number of pages4
JournalMaterials Science Forum
Volume264-268
Issue numberPART 2
DOIs
Publication statusPublished - 1 Feb 1998
Externally publishedYes

Keywords

  • CH
  • CHF
  • GaN
  • PMMA
  • Reactive Ion Etching
  • SiCl
  • SiN
  • Ti

ASJC Scopus subject areas

  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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