Electrical behaviour of nanosilver doped gallium flexible conductor for biomedical application

Kho Y. Shan, Mahmood Anwar, Sumaiya Islam, Sujan Debnath, H. Mas-Ayu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)
8 Downloads (Pure)

Abstract

In the biomedical field, continuous researches have been expanding on doping of metals to acquire new materials for flexible conductors. Flexible conductors have been rapidly sought in several biomedical applications such as biosensors, implants, prostheses, etc. For example, prostheses are to mimic the movement of the human body which enables flexible and repetitive movement. However, these alloys functions hampered due to fatigue or loss of conductivity when subjected to bending. To address such issue, gallium is a potential solution as it has high ductility. However, gallium has relatively low electrical conductivity. In order to enhance the conductivity, nanosilver was used to doped as silver has the highest electrical conductivity. Moroever, nanosilver enables better diffusibility into the gallium matrix. In this research, for doping process, gallium and nanosilver were mixed at six different ratios, which were Ga:Ag of 1:1, 2:1, 3:1, 4:1, 5:1 and 6:1. It is revealed that higher concentration of gallium to nanosilver provides better diffusion, and better electrical behaviour. It is also revealed that the Ga:Ag of 3:1 is the most effective concentration in terms of better homogeneity and lower electrical resistance. Such findings are crucial for proper doping process and considered as the founding parameters for better alloy formation. Nevertheless, these findings would also contribute to biomedical research industry especially for artificial organ through developing new alloy materials.

Original languageEnglish
Title of host publicationIOP Conference Series: Materials Science and Engineering
PublisherIOP Publishing
Volume495
DOIs
Publication statusPublished - 28 Nov 2019
Externally publishedYes
Event11th Curtin University Technology, Science and Engineering International Conference - Miri, Sarawak, Malaysia
Duration: 26 Nov 201828 Nov 2018

Publication series

NameIOP Conference Series: Materials Science and Engineering
PublisherIOP Publishing
ISSN (Print)1757-8981

Conference

Conference11th Curtin University Technology, Science and Engineering International Conference
Abbreviated titleCUTSE 2018
Country/TerritoryMalaysia
CitySarawak
Period26/11/1828/11/18

ASJC Scopus subject areas

  • General Materials Science
  • General Engineering

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