Three-dimensional Networks-on-Chips (3D NoCs) have recently been proposed to address the on-chip communication demands of future highly dense 3D multi-core systems. Homogeneous 3D NoC topologies have many Through Silicon Vias (TSVs) which have a costly and complex manufacturing process. Also, 3D routers use more memory and are more power hungry than conventional 2D routers. Alternatively, heterogeneous 3D NoCs combine both the area and performance benefits of 2D and 3D static router architectures by using a limited number of TSVs. To improve the performance of heterogeneous 3D NoCs, we propose an adaptive router architecture which balances the traffic in such NoCs.
- NoC architecture