An improved Weibull model with consideration of thermal stress for analysis of cable joint failures

Huajie Yi, Ian Hancock, Dong Chen, Chengke Zhou

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The Weibull model as a statistical method has been widely used for analysis of cable failure data and for prediction of future failure rate on an annual basis. However, previously published approaches cannot be relied on to model the phenomenon that higher number of failures of cable joint has been observed during summer time by Scottish Power Energy Networks (SPEN). Seasonal temperature higher than 20^{\circ}\mathrm{C} resulted in increasing failure rate of cable joints, especially for the joints which connect PILC cables. When the ambient temperature was lower than 15^{\circ}\mathrm{C}, the failure rate of cable joint became smaller. This paper aims to improve the standard Weibull model to allow predictions of number of failures with consideration of seasonal temperature. The thermal stress caused due to seasonal temperature is treated as a variable to correct the failure rate obtained via standard Weibull analysis, as the number of failures has been heavily related to seasonal temperature. With the improved model, failure prediction can forecast higher number of failures during the summer season.

Original languageEnglish
Title of host publication2020 IEEE 3rd International Conference on Dielectrics (ICD)
PublisherIEEE
Pages609-612
Number of pages4
ISBN (Electronic)9781728189833
ISBN (Print)9781728189840
DOIs
Publication statusPublished - 5 Jul 2020
Event3rd IEEE International Conference on Dielectrics, ICD 2020 - Virtual, Valencia, Spain
Duration: 5 Jul 202031 Jul 2020

Publication series

NameProceedings of the 2020 IEEE 3rd International Conference on Dielectrics, ICD 2020

Conference

Conference3rd IEEE International Conference on Dielectrics, ICD 2020
Country/TerritorySpain
CityVirtual, Valencia
Period5/07/2031/07/20

Keywords

  • analytical models
  • statistical analysis
  • predictive models
  • thermal analysis
  • thermal stresses
  • stress
  • standards

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Fingerprint

Dive into the research topics of 'An improved Weibull model with consideration of thermal stress for analysis of cable joint failures'. Together they form a unique fingerprint.

Cite this